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Plasma processing method and apparatus for eliminating damages in a plasma process of a substrate
Plasma processing method and apparatus for eliminating damages in a plasma process of a substrate
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机译:用于消除基板的等离子体处理中的损伤的等离子体处理方法和装置
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摘要
A plasma processing method comprises the steps of supplying a low-frequency bias to a first electrode carrying a substrate, and supplying a high-frequency power to a second electrode facing the first electrode, wherein the low-frequency bias is supplied to the first electrode in advance of starting plasma by the energy of the high-frequency power, with an electric power sufficient to form an ion-sheath on the surface of the substrate.
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