Methods for testing a group of semiconductor devices simultaneously, and devices amenable to such methods of testing

摘要

Methods are provided for testing many semiconductor devices simultaneously. The devices are connected in a group, and checked for DC-type defects. Those identified to have such a defect are electrically disconnected from the group, and thus also from further group testing. Then testing in the AC mode is performed. The disconnected devices do not sense the AC testing, and the defect does not affect the testing of the others. Semiconductor devices are also provided that are amenable to such testing. These include additional pads, and a special circuit that includes at least one fuse. Disconnection is by cutting the fuse of a device identified to be defective. While afterwards testing for AC-type defects, the power supply and the ground is applied through the additional pads. This grounds the power line of defective chips.