Low-temperature patterned wafer bonding with photosensitive benzocylobutene (bcb) and 3d microelectromechanical systems fabrication

摘要

A method of low-temperature (150-300°C) patterned wafer bonding of complex 3D MEMS comprising providing a first pre-processed wafer (100) having a first surface and a second pre-processed wafer (102) having a second surface. Photosensitive benzocyclobutene (BCB) polymer (106) is then applied to the first surface of the first wafer (100) in a predetermined pattern to define a bonding layer. The second wafer (102) is then bonded to the first wafer (100) only along the bonding layer.