ELECTRONIC PACKAGE WITH IMPROVED CAP DESIGN FOR REDUCED INTERFACIAL STRESSES

摘要

An electronic package has a substrate (12) having an upper surface; a semiconductor chip (14) mounted on said upper surface of said substrate and electrically and mechanically coupled to said substrate, said semiconductor chip having a substantially planar upper surface (20); a thermally conductive member (22) constituted of a mesh-like material and having upper and lower surfaces, at least said lower surface being thermally coupled to said upper surface of said semiconductor chip; and dielectric material (24) being imparted to at least a portion of said substrate, and to a portion of said upper surface of said thermally conductive member.