首页> 外国专利> MILLIMETER WAVE MODULE (MMW) FOR MICROWAVE MONOLITHIC INTEGRATED CIRCUIT (MMIC)

MILLIMETER WAVE MODULE (MMW) FOR MICROWAVE MONOLITHIC INTEGRATED CIRCUIT (MMIC)

机译:毫米波单模集成电路(MMIC)的毫米波模块(MMW)

摘要

A low cost millimeter wave (MMW) module for a microwave monolithic integrated circuit (MMIC) includes a carrier board formed of a dielectric material and having at least one MMIC die mounted thereon and at least one interface line, such as a 50 Ohm microstrip interface line. A base plate is formed of a material that has a higher unmatched coefficient of thermal expansion (CTE) than the carrier board and supports same. A housing is mounted over the carrier board and engages the base plate. The housing has at least one subminiature coaxial connector (SMA) interface mounted thereon. A flexible circuit interconnect, such as a fuzz button, connects the subminiature coaxial connector and MMIC die through the interface line. A thermal interface member is positioned between the carrier board and base plate to aid in heat transfer between the base plate and housing and the lower CTE carrier board.
机译:一种用于微波单片集成电路(MMIC)的低成本毫米波(MMW)模块,其包括由介电材料形成并且具有安装在其上的至少一个MMIC管芯和至少一条接口线(例如50 Ohm微带接口)的载板。线。基板由具有比承载板更高的不匹配热膨胀系数(CTE)的材料形成并支撑该基板。外壳安装在承载板上,并与基板接合。壳体上安装有至少一个超小型同轴连接器(SMA)接口。柔性电路互连(例如模糊按钮)通过接口线连接超小型同轴连接器和MMIC芯片。热界面构件位于承载板和基板之间,以帮助基板和外壳与下部CTE承载板之间的热传递。

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