Gas compound for plasma spraying and its application to refractory material plasma spraying

摘要

A plasma-forming gas, comprising ≥ 30% helium, ≥ 55% argon and 5.5-15% hydrogen, is new. Independent claims are also included for the following: (i) a thermal spray process employing the above plasma-forming gas; and (ii) on-site production of the above plasma-forming ternary gas mixture.