A laser solder head for connecting metallic components can be moved with a hand manipulation apparatus along a solder gap formed by the components. It has adjusting devices to adjust a solder wire supplied continuously to the solder gap as well as laser beam conducted via an optic fibre cable, meeting the components to be joined in the region of the solder gap. The laser beam emerging from the optic fibre cable (2) near the soldering site and the solder wire (4) are fixed mechanically to each other and to the solder gap (3) by a justifying element (11) held on the laser solder head (1). The laser solder head, which is connected with the hand manipulation apparatus in linked fashion, is guided mechanically at the solder gap by the justifying element or by the justified solder wire on this.
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