首页>
外国专利>
A method for Cu electroplating in integrated circuit fabrication
A method for Cu electroplating in integrated circuit fabrication
展开▼
机译:集成电路制造中的铜电镀方法
展开▼
页面导航
摘要
著录项
相似文献
摘要
The electroplating of copper is the leading technology for forming copper lines on integrated circuits. In the copper electroplating process a negative potential is applied to the semiconductor wafer with the surface of the semiconductor wafer acting as the cathode. The anode will be partially or wholly formed with copper. Both the anode and the semiconductor wafer will be exposed to a solution comprising copper electrolytes. By reducing the temperature of the copper electrolyte solution below 25°C the rate of self annealing grain growth will increase reducing the final resistively of the copper lines.
展开▼