PLATING METHOD AND APPARATUS THAT CREATES A DIFFERENTIAL BETWEEN ADDITIVE DISPOSED ON A TOP SURFACE AND A CAVITY SURFACE OF A WORKPIECE USING AN EXTERNAL INFLUENCE

摘要

The present invention relates to a kind of surfaces for plating conductive base in ideal mode. The present invention, which removes at least one additive and is adsorbed in the top portion of workpiece, to be arranged more than at least one additive in cavity, to allow to occur before plate conductive material, the additive is adsorbed onto the top again completely, and results in bigger plate cavity portion relative to top.