/ Anisotropic Conductive Adhesive with Low Electrical Resistance and High Current Carrying Capacity for High Power Modules Applications

摘要

PURPOSE: An anisotropic conductive adhesive composition for joining a high powder module, and an anisotropic conductive film for joining a flip chip and an anisotropic conductive paste using the adhesive composition are provided, wherein the composition has a low electrical resistance, a high critical current density and excellent mechanical properties. CONSTITUTION: The adhesive composition comprises a low electrical resistance conductive particle and a non-conductive particle having a high thermal conductivity and a low coefficient of thermal expansion uniformly dispersed in an insulating resin. Preferably the conductive particle has a resistivity of 0.1-2 Ohmcm and is at least one selected from copper or a metal-coated copper; and the non-conductive particle has a thermal conductivity of 150-400 W/mdeg.C and a coefficient of thermal expansion of 2-10 ppm/deg.C, and is at least one selected from the group consisting of SiC, AlN and Al2O3.