Integrated Management System for automated wire bonding processes

摘要

PURPOSE: An integrated management system for an automated wire bonding process is provided to be capable of using the data generated while designing a chip and a lead frame at an assembly process. CONSTITUTION: An integrated management system(100) for an automated wire bonding process is provided with a DMS(Drawing Management System)(200) for drawing an assembly reference containing a bonding figure, a package outline figure, a package pin configuration and pin coordinate data, and an eSPEC(300) for forming a bonding specification by using the assembly reference as basic data. The integrated management system further includes a DMS database server, a DMS file server, and DMS web server. At this time, the DMS database server manages the assembly reference, the bonding specification and reference information, the DMS file server manages the outline figure, the bonding figure and standard file, and the DMS web server manages web interface.