METHOD OF ANALYZING FACTOR RESPONSIBLE FOR ERRORS IN WAFER PATTERN, AND APPARATUS FOR PRODUCING PHOTOLITHOGRAPHIC MASK

摘要

A method of analyzing factor responsible errors in a wafer pattern which enables detection of an error ascribable to a difference between mask patterns and an error ascribable to another reason while distinguishing between the errors. A mask pattern is formed by etching a first mask at a first position within an etching chamber. Another mask pattern is formed by etching a second mask at a second position within the etching chamber. A wafer pattern is formed by single shot of exposing radiation through use of the first mask, and another wafer pattern is formed by single shot of exposing radiation through use of the second mask. The size of the wafer pattern formed through use of the first mask and the size of the wafer pattern formed through use of the second mask are compared with each other, thereby detecting a dimensional difference ascribable to a difference between mask patterns and a dimensional difference ascribable to another reason while distinguishing between the dimensional differences.