首页> 外国专利> PROCESS OF ION-PLASMA DEPOSITION OF MULTICOMPONENT FILM COATS , MOSAIC TARGET FOR ITS IMPLEMENTATION AND PROCESS OF MANUFACTURE OF TARGET

PROCESS OF ION-PLASMA DEPOSITION OF MULTICOMPONENT FILM COATS , MOSAIC TARGET FOR ITS IMPLEMENTATION AND PROCESS OF MANUFACTURE OF TARGET

机译:多组分薄膜的离子等离子沉积工艺,镶嵌靶的实现及靶制备工艺

摘要

FIELD: electronic, atomic, optical and other branches of science and technology. SUBSTANCE: process of ion-plasma deposition of multicomponent film coats includes formation of orthogonal magnetic and electric fields in magnetron facility, sputtering of mosaic target containing inserts of heterogeneous metals and deposition of sputtered materials on backings anchored on anode. Target in which inserts are worked deeper and/or protrude relative to surface of other elements of target in erosion zone within bounds from 0.01 to 0.1 mm is utilized for sputtering. Total area of surface of inserts from each. material is proportional to concentration of element in coat. Sputtering is executed in balanced magnetron system with density of discharge power from 20 to 500 W/sq cm and residual induction from 0.03 to 0.1 T. Coat is deposited under steady-state condition with same linear rate of sputtering of materials of mosaic target. Mosaic target includes flat matrix anchored on cooled base and inserts of sputtered heterogeneous materials put on matrix and located uniformly in zone of target erosion along projections of lines of forces of magnetic field embedded and/or protruding relative to surface of other elements of target within limits from 0.01 to 0.1 mm. Total area of surface of inserts of each material is proportional to concentration of element in coat. Process of manufacture of target includes fabrication of elements of target and cooled base, assembly of target elements on base. Target is sputtered in balanced magnetron system with density of discharge in erosion zone from 20 to 500 W/sq cm and intensity of magnetic field from 0.03 to 0.1 T in the course of 15-30 min. EFFECT: formation of multicomponent films of specified composition under steady-state condition at high rate of sputtering. 14 cl, 5 dwg, 1 tbl
机译:领域:电子,原子,光学和其他科学技术分支。物质:多组分薄膜涂层的离子等离子体沉积过程包括在磁控管中形成正交磁场和电场,溅射包含异质金属插入物的镶嵌靶材以及将溅射材料沉积在锚定在阳极上的背衬上。相对于靶材的其他元素的表面在0.01至0.1 mm范围内的腐蚀区域中的插入物相对于靶材的其他元素的表面更深和/或突出的靶材,可用于溅射。每个刀片的总表面积。材料与涂层中元素的浓度成正比。在平衡磁控管系统中执行溅射,其放电功率密度为20至500 W / sq cm,残留感应强度为0.03至0.1T。在稳态条件下,以相同的溅射靶材料的溅射速率线性沉积涂层。镶嵌靶包括锚固在冷却基座上的扁平基体和放置在基体上并沿着相对于目标的其他元素的表面嵌入和/或突出的磁场力线的投影均匀分布在目标侵蚀区域中的溅射异质材料插入物从0.01到0.1毫米每种材料的嵌件表面总面积与涂层中元素的浓度成正比。靶的制造过程包括靶和冷却底座的元件的制造,靶元件在底座上的组装。在15-30分钟的过程中,在平衡磁控管系统中溅射靶材,腐蚀区的放电密度为20至500 W / sq cm,磁场强度为0.03至0.1T。效果:在稳态条件下以高溅射速率形成特定组成的多组分薄膜。 14厘升,5公升,1公吨

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