Micro-fluid hollow plastics structures, useful for cooling micro-electronic components in high integrated circuits and power units, are formed in a single process cycle, using a thermoplastic film shaped by molding cavities

摘要

Producing micro-fluid hollow plastics structures using a single process cycle within a heat shaping machine or hot embossing press mold. A thermoplastic film is shaped into fluid micro-structures by heat and is bonded to a rigid substrate. The mold plate has cavities, and a counter plate has holes to evacuate the mold and holes to apply pressure to the film. To produce micro-fluid hollow plastics structures (1), a single process cycle is used within the mold of a heat shaping machine or hot embossing press. At least one thermoplastic film is shaped by heat into fluid micro-structures by a heated gas or fluid pressure medium. It is bonded to a substrate (3) which is rigid, or has rigid flexibility, and with a shape unaffected by temperature or pressure. The mold plate (5) has cavities (8), and a counter plate (6) has holes (9) to evacuate the mold and holes (10) to apply pressure to the film. A seal (7) allows a vacuum (11) to be developed in the zone between the mold and counter plates.