Device for deforming heated thermoplastic resin film to form molded component, has refrigerant circuit that is provided with bypass between cooling device and molding tools, for direct temperature control of film-transporting unit

摘要

The device comprises a heating device (5) for heating a thermoplastic resin film. A molding station (6) is equipped with molding tools (7) for molding the heated film. A refrigerant circuit consisting of a supply pipe (13) and a return pipe (14), is arranged between a cooling device (12) and the molding tools, for cooling the molding tools. The refrigerant circuit has a bypass that is provided between the cooling device and the molding tools, for direct temperature control of a film-transporting unit (4) for transporting the resin film. An independent claim is included for a method for controlling the temperature of a film-transporting unit.