首页> 外国专利> Chemically-enhanced photo-resist for use, e.g. in the production of structured chips for the semiconductor industry, comprises a solution of acid-labile polymer containing fluorinated cinnamate monomer units

Chemically-enhanced photo-resist for use, e.g. in the production of structured chips for the semiconductor industry, comprises a solution of acid-labile polymer containing fluorinated cinnamate monomer units

机译:使用化学增强的光致抗蚀剂,例如在半导体行业结构化芯片的生产中,包含酸不稳定的聚合物溶液,该溶液包含氟化肉桂酸酯单体单元

摘要

Chemically-enhanced photo-resist (I) comprising a polymer with acid-labile groups which undergo cleavage to polar groups so as to increase solubility in aqueous alkaline developers, plus a photo-acid former and solvent, in which the polymer contains first repeat units derived from at least mono-fluorinated or fluoroalkyl-substituted cinnamic acid or cinnamate esters. An Independent claim is also included for a method for structuring substrates by coating the substrate with (I), exposing parts of the resulting photo-resist film to light with a wavelength of less than 200 nm and developing the exposed film to form a structure which is transferred to the substrate.
机译:化学增强的光致抗蚀剂(I),包括带有酸不稳定基团的聚合物,该酸不稳定基团会裂解成极性基团,从而增加在碱性显影液中的溶解度,此外还包括光酸形成剂和溶剂,其中该聚合物包含第一重复单元衍生自至少单氟化或氟烷基取代的肉桂酸或肉桂酸酯。还包括一种用于对基板进行结构化的方法,该方法是通过在基板上涂上(I),将所得光刻胶膜的部分曝光于波长小于200 nm的光,并对曝光后的膜进行显影以形成结构,被转移到基板上。

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