Method for producing a punched multi-hole mask produces a desired pattern of holes for the projection of particle radiation by cutting holes in a flattened stretched blank subjected to distorting forces after cutting.

摘要

Production of a punched multi-hole mask involves a layered structure of a bottom layer (11) of silicon, a thin oxide center layer (12) of silicon dioxide and a relatively thin top layer (13) of silicon. Dosing with ion radiation and thermal healing changes the mechanical layer tension of the top layer, which is structured and etched in areas of relief for a layer of paint (15) as far as the oxide layer below.