Method, for connecting component to substrate, involves applying underfill material by immersing at least part of component into tank of underfill material before placing component onto substrate

摘要

Method involves using an intermediate layer of underfill material and fixing the component using solder. The component is placed in a desired position on a substrate with underfill material in the gap between the component and substrate, then forming solder connections. The underfill material is applied by immersing at least part of the component (18) into a tank (21) of underfill material (13) before placing the component onto the substrate. AN Independent claim is also included for an arrangement for applying underfill material to a component with contacts by immersion..