首页> 外国专利> Photolithography method for fabrication of microstructure e.g. dynamic RAM interconnect, involves exposing substrate with trimming mask having trimming openings, after initial exposure using alternating phase mask

Photolithography method for fabrication of microstructure e.g. dynamic RAM interconnect, involves exposing substrate with trimming mask having trimming openings, after initial exposure using alternating phase mask

机译:用于制造微结构的光刻方法,例如动态RAM互连涉及在使用交替相位掩模进行初始曝光之后,使用具有修剪开口的修剪掩模对基板进行曝光

摘要

A substrate is exposed with an alternating phase mask to form a microstructure e.g. interconnects of a dynamic RAM (DRAM) on the substrate. The substrate is then exposed with a trimming mask having at least two trimming openings (31,32), for producing an alternating phase shift. An Independent claim is also included for a trimming mask.
机译:用交替相掩模曝光衬底,以形成例如微结构的微结构。基板上动态RAM(DRAM)的互连。然后用具有至少两个修整开口(31,32)的修整掩模对基板进行曝光,以产生交替的相移。修剪蒙版还包括独立索赔。

著录项

  • 公开/公告号DE10149304A1

    专利类型

  • 公开/公告日2003-04-30

    原文格式PDF

  • 申请/专利权人 INFINEON TECHNOLOGIES AG;

    申请/专利号DE2001149304

  • 发明设计人 KNOBLOCH JUERGEN;

    申请日2001-10-01

  • 分类号G03F9/00;

  • 国家 DE

  • 入库时间 2022-08-21 23:42:36

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