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Photolithography method for fabrication of microstructure e.g. dynamic RAM interconnect, involves exposing substrate with trimming mask having trimming openings, after initial exposure using alternating phase mask
Photolithography method for fabrication of microstructure e.g. dynamic RAM interconnect, involves exposing substrate with trimming mask having trimming openings, after initial exposure using alternating phase mask
A substrate is exposed with an alternating phase mask to form a microstructure e.g. interconnects of a dynamic RAM (DRAM) on the substrate. The substrate is then exposed with a trimming mask having at least two trimming openings (31,32), for producing an alternating phase shift. An Independent claim is also included for a trimming mask.
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