首页> 外国专利> Formation of a diamond coating on a substrate, e.g. tools and precision components, comprises subjecting the substrate to a reactive gas mixture exited by a vacuum atmosphere by a plasma discharge

Formation of a diamond coating on a substrate, e.g. tools and precision components, comprises subjecting the substrate to a reactive gas mixture exited by a vacuum atmosphere by a plasma discharge

机译:在基材上形成金刚石涂层,例如工具和精密部件,包括使衬底经受由等离子体放电在真空气氛中逸出的反应气体混合物

摘要

Process for forming a diamond coating on a substrate comprises subjecting the substrate to a reactive gas mixture exited by a vacuum atmosphere by a plasma discharge. The plasma discharge comprises a plasma beam (14) in an evacuated vessel (16) formed between a cathode chamber (1) and an anode (2). The reactive gas mixture comprises a reactive gas and a working gas. The evacuated vessel is pumped out using a pumping arrangement (15). The hydrogen concentration of the gas mixture is 0-45 vol.%. Preferably the hydrogen concentration of the gas mixture is selected so that the diamond coating has an average crystal size of less than 50, preferably 1-30 nm, and the substrate temperature is 300-750 deg C. The concentration of the reactive gas in the gas mixture is 0.1-85 vol.%. The reactive gas contains hydrogen, carbon-containing gases and nitrogen-containing gases, especially nitrogen. The working gas contains a noble gas. The plasma beam is formed as a low voltage arc discharge, preferably as a high current arc discharge.
机译:在基材上形成金刚石涂层的方法包括使基材经受由真空气氛通过等离子体放电排出的反应性气体混合物。等离子体放电包括在阴极室(1)和阳极(2)之间形成的真空容器(16)中的等离子体束(14)。反应性气体混合物包括反应性气体和工作气体。使用抽水装置(15)将抽空的容器抽出。气体混合物的氢浓度为0-45体积%。优选地,选择气体混合物的氢浓度,使得金刚石涂层的平均晶体尺寸小于50,优选为1-30nm,并且基材温度为300-750℃。气体混合物为0.1-85体积%。反应性气体包含氢,含碳气体和含氮气体,特别是氮气。工作气体包含稀有气体。等离子束形成为低压电弧放电,优选为大电流电弧放电。

著录项

  • 公开/公告号DE10149588A1

    专利类型

  • 公开/公告日2003-04-10

    原文格式PDF

  • 申请/专利权人 UNAXIS BALZERS AG BALZERS;

    申请/专利号DE2001149588

  • 发明设计人 FRANZ DAVID;KARNER JOHANN;

    申请日2001-10-08

  • 分类号C23C16/27;C23C16/455;C23C16/513;

  • 国家 DE

  • 入库时间 2022-08-21 23:42:40

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