Lead-free glass tubing for making encapsulated electronic component comprises silicon dioxide, boron trioxide, aluminum trioxide, lithium oxide, sodium oxide, potassium oxide, calcium oxide, barium oxide, zinc oxide, and titanium dioxide

摘要

A lead-free glass tubing comprises composition having (wt.% oxide) silicon dioxide (34-52), boron trioxide (10-25), aluminum trioxide (0-25), lithium oxide (2-6), sodium oxide (4-10), potassium oxide (2-6), calcium oxide (0-4), barium oxide (1-5), zinc oxide (4-12), titanium dioxide (2-6), and refining agent(s) for refining. Independent claims are also included for: (a) a method of making encapsulated electronic component comprising encapsulating electronic component in lead-free glass tubing; and (b) an encapsulated diode comprising diode, and lead-free glass tubing.