Making ceramic thin film elements in multilayer boards involves compressing conducting material layers in multilayer layers as capacitor plates, introducing conducting channel, coating with dielectric

摘要

The method involves compressing layers of a conducting material contained in the layers of the fabricated multilayer as two plates of a capacitor, introducing a channel of conducting material of 5 -500 microns diameter between the layers of conducting material and coating the capacitor plates with less than 1 micron thin layers of a material with a dielectric constant of greater than 1000 before compression.