Fabrication of semiconductor layers for thin-film semiconductor components, by applying useful layer with semiconductor layers to carrier, applying auxiliary carrier remote from carrier by connecting layer, and stripping away the carrier

摘要

Semiconductor layers are fabricated by applying a useful layer containing semiconductor layer(s) to a carrier, applying an auxiliary carrier to the side of the useful layer remote from the carrier with a connecting layer disposed between the auxiliary carrier and useful layer at a joining temperature, and mechanically stripping away the carrier. Fabrication of semiconductor layers involves applying a useful layer containing semiconductor layer(s) to a carrier (1), applying an auxiliary carrier to the side of the useful layer remote from the carrier with a connecting layer disposed between the auxiliary carrier and useful layer (2) at a joining temperature, and mechanically stripping away the carrier at temperature greater than or equal to the joining temperature and less than a melting point of the connecting layer. At least a part of the useful layer together with the auxiliary carrier (3) is stripped away from the carrier.