Aqueous polish used for polishing semiconductor wafer, especially silicon, with or without applied coating and copper wiring, contains abrasive or colloid and disuccinate, e.g. iminodisuccinate, as chelating agent

摘要

Polish contains (a) water, (b) abrasive and/or colloid and (c) a disuccinate (I), comprising iminodisuccinic acid, ethylenediamine-disuccinic acid or diethylenetriamine-disuccinic acid and/or its alkali metal salt. Polish contains: (a) water; (b) abrasive and/or colloid; and (c) a disuccinate of formula (I), comprising iminodisuccinic acid, ethylenediamine-disuccinic acid or diethylenetriamine-disuccinic acid and/or its alkali metal salt. X = H and/or alkali metal; and n = 0, 1 or 2.