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Laterally radiating light emitting diodes structure

机译:横向辐射发光二极管结构

摘要

A sideway-projecting light emitting diode (LED) includes an enclosure made of a light-transmitting material having first and second opposite side faces. The first side face forms a light-focusing portion. First and second conductive terminals are fixed in the enclosure and have tails extending beyond the second side face. A support member made of conductive materials has an inner end fixed in the enclosure between the first and second terminals and a remote end extending beyond the side face. A bowl is formed on the inner end of the support member for receiving and retaining a chip substantially confronting the light-focusing portion and electrically connected to the first and second terminals. A heat dissipation plate is mounted to the remote end of the support member for enhancing heat dissipation of the light emitting diode which in turn allows for increased power consumption of the light emitting diode and increased brightness of the light emitted from the light emitting diode. By edge-mounting the light emitting diode to an edge of a circuit board with the tails of the terminals soldered to the circuit board, light emitted from the chip is allowed to project through the light-focusing, portion in a sideway direction with respect to the circuit board.
机译:侧向投射发光二极管(LED)包括由具有第一和第二相对侧面的透光材料制成的外壳。第一侧面形成聚光部分。第一和第二导电端子固定在外壳中,并且具有延伸超过第二侧面的尾部。由导电材料制成的支撑构件具有固定在第一和第二端子之间的外壳中的内端和延伸超过侧面的远端。在支撑构件的内端上形成有碗状部,该碗状部用于接收并保持基本上面对聚光部并且电连接至第一端子和第二端子的芯片。散热板被安装到支撑构件的远端以用于增强发光二极管的散热,这进而允许增加发光二极管的功耗以及增加从发光二极管发射的光的亮度。通过将发光二极管边缘安装在电路板的边缘上,并将端子的尾部焊接到电路板上,从芯片发出的光可以通过聚光部分投射到相对于侧面的方向上。电路板。

著录项

  • 公开/公告号DE20214919U1

    专利类型

  • 公开/公告日2002-11-21

    原文格式PDF

  • 申请/专利权人 PARA LIGHT ELECTRONICS CO. LTD.;

    申请/专利号DE2002214919U

  • 发明设计人

    申请日2002-09-27

  • 分类号H01L33/00;H01L25/13;

  • 国家 DE

  • 入库时间 2022-08-21 23:41:21

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