Heat-sink for electronic components, especially processors, has baseplate comprising large number of thin metal tubes or wires bundled together, and ribs comprising metal strips or wires

摘要

The heat sink includes a baseplate and ribs. The baseplate comprises a large number of thin metal tubes or wires which are bundled together to form one unit, in such a way that air can penetrate the baseplate. The ribs may consist of a large number (over 500) of metal strips or wires of small diameter.