首页> 外国专利> LED arrangement including LED chip for display - has surface contact metallisation on chip connected to electrical conductors on transparent conductor track carrier fixed to chip

LED arrangement including LED chip for display - has surface contact metallisation on chip connected to electrical conductors on transparent conductor track carrier fixed to chip

机译:包括用于显示的LED芯片的LED装置-芯片上的表面接触金属化层连接到固定在芯片上的透明导体轨道载体上的​​电导体上

摘要

The LED arrangement includes at least one LED chip with surface contact metallisation connected to a first electrical conductor. The electrical conductors, e.g. conductor tracks, are arranged on a transparent conductor track carrier fixed to the LED chip. The chip also has contact metallisation on its bottom surface which is connected to a second electrical conductor on a second carrier. A free intermediate space between the light output surface of the LED chip and the first conductor carrier is filled with an optical coupling medium. The LED arrangement preferably includes several LED chips arranged in rows and columns.
机译:该LED装置包括至少一个LED芯片,该LED芯片的表面接触金属化连接至第一电导体。电导体,例如导体轨道布置在固定到LED芯片的透明导体轨道载体上。芯片在其底面上还具有接触金属化层,该接触金属化层与第二载体上的第二电导体相连。 LED芯片的光输出表面和第一导体载体之间的自由中间空间被光耦合介质填充。 LED布置优选地包括以行和列布置的几个LED芯片。

著录项

  • 公开/公告号DE29624411U1

    专利类型

  • 公开/公告日2003-07-03

    原文格式PDF

  • 申请/专利权人 SIEMENS AG;

    申请/专利号DE1996224411U

  • 发明设计人

    申请日1996-01-31

  • 分类号H01L25/075;H01L23/485;G09F9/30;

  • 国家 DE

  • 入库时间 2022-08-21 23:40:36

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