MECHANICAL-CHEMICAL POLISHING MACHINE FOR A MATERIAL WAFER AND ABRASIVE DISPENSING DEVICE EQUIPPED WITH SUCH A MACHINE

摘要

P The invention relates to a mechanical-chemical polishing machine for a wafer (P) of a material, this machine comprising a rotary polishing plate (1), a polishing head (4) comprising a non-rotating part (42) and a rotary part (40, 41) and means (5) for distributing an abrasive (A) to the surface of said polishing plate (1). This machine is remarkable in that the means (5) for distributing the abrasive (A) comprise a hollow ring (50) for distributing the abrasive, provided with means (51) for supplying the abrasive, with a plurality of abrasive distribution orifices distributed over its underside (502) and fixing means (420, 520, 52) making it integral with said non-rotating part (42) of the polishing head (4), this ring (50) being arranged around said rotating part (40, 41), in a plane substantially parallel to the plane of said polishing plate (1) but spaced therefrom. Application to wafer polishing s (P) of semiconductor material. / P