JOINT STRUCTURE OF PIEZOELECTRIC VIBRATION PIECE, PIEZOELECTRIC DEVICE, ITS MANUFACTURING METHOD, CELL PHONE UNIT USING PIEZOELECTRIC DEVICE, AND ELECTRONIC EQUIPMENT USING PIEZOELECTRIC DEVICE

摘要

PPROBLEM TO BE SOLVED: To provide the joint structure of a piezoelectric vibration piece for obtaining sufficient joint strength by overcoming various defects in the case that a conductive adhesive is used, and to provide a piezoelectric device providing the joint structure, its manufacturing method, a cell phone unit and electronic equipment using the piezoelectric device . PSOLUTION: The piezoelectric device 30 provided with a sealing structure isolated from outside by joining the piezoelectric vibration piece 32 on an insulating substrate 61 comprises the piezoelectric vibration piece 32 for forming a joint electrode part on at least a main face and a side adjacent to the main face, and the insulating substrate 61 provided with a planar electrode pad joining the piezoelectric vibration piece. Metal bumps 71 and 72 arranged by corresponding to a position along the outer edge of a region providing the electrode of the piezoelectric vibration piece joined to an electrode pad 31 are joined on the main face and the side of the piezoelectric vibration piece deformed by pressuring on the electrode pad of the insulating substrate. PCOPYRIGHT: (C)2005,JPO&NCIPI