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HEAT CONDUCTION STRUCTURE BETWEEN HEATING ELEMENT AND OBJECT TO BE HEATED

机译:加热元件与被加热物体之间的导热结构

摘要

PROBLEM TO BE SOLVED: To provide a heat conduction structure or a heat conduction method between a heating element and an object to be heated excellent in heat uniformity and heat conduction efficiency at a comparatively low cost.;SOLUTION: The heat conduction structure carries out the heat conduction by interposing a heat conducting medium between the heating element 3 and the object to be heated 4, the heat conducting medium composed of many metal particles 5.;COPYRIGHT: (C)2004,JPO
机译:解决的问题:提供一种在加热元件和被加热物体之间的导热结构或导热方法,其热均匀性和导热效率极低,且成本较低。通过在加热元件3和要加热的物体4之间插入导热介质进行导热,该导热介质由许多金属颗粒5组成;版权:(C)2004,JPO

著录项

  • 公开/公告号JP2004139927A

    专利类型

  • 公开/公告日2004-05-13

    原文格式PDF

  • 申请/专利权人 CANON INC;

    申请/专利号JP20020305493

  • 发明设计人 FUSE TOSHIHIRO;

    申请日2002-10-21

  • 分类号H05B3/12;

  • 国家 JP

  • 入库时间 2022-08-21 23:35:08

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