METHOD FOR MEASURING DAMAGE LAYER THICKNESS AND FLEXURAL STRENGTH OF SEMICONDUCTOR SUBSTRATE AND LAMINATOR USED IN MEASURING THEM

摘要

PROBLEM TO BE SOLVED: To provide a method for measuring the thickness of a damage layer occurring in the step of laminating a semiconductor substrate and to provide a method for measuring the flexural strength of the semiconductor substrate under the lamination conditions used.;SOLUTION: The measurement method uses a device that laminates a semiconductor substrate in the state fixed and suctioned by vacuum. In the step of laminating the semiconductor substrate, the thickness of the damage layer is determined from the thickness of the semiconductor substrate at the time when the semiconductor substrate is broken in the state in which it is not subjected to the vacuum suctioning action. The flexural strength of the semiconductor substrate under the lamination conditions used can be obtained from the thickness of the semiconductor substrate at the time when the substrate is broken in the step of lamination of the semiconductor substrate fixed in the state in which it is subjected to the vacuum suctioning action.;COPYRIGHT: (C)2004,JPO