首页> 外国专利> HIGH-PRECISION ANALOG CAPACITOR WITH LOW VOLTAGE COEFFICIENT AND LOW HYSTERESIS AND ITS INNOVATIVE CONFIGURATION METHOD

HIGH-PRECISION ANALOG CAPACITOR WITH LOW VOLTAGE COEFFICIENT AND LOW HYSTERESIS AND ITS INNOVATIVE CONFIGURATION METHOD

机译:低电压系数,低迟滞的高精度模拟电容器及其创新配置方法

摘要

PROBLEM TO BE SOLVED: To provide a method and equipment for forming an analog capacitor on a semiconductor substrate.;SOLUTION: This method includes a process where a field oxide is formed on a portion of a substrate, and a polysilicon layer is formed on the field oxide, then a silicide layer is formed on the layer. A first interlayer dielectric layer is formed on the substrate, and a capacitor masking pattern is formed. Using the capacitor masking pattern as a mask and the silicide layer as an etch stop, the first interlayer dielectric layer is etched to form a thin dielectric on the substrate. A contact masking pattern is formed on the substrate. Using the silicide layer and substrate as etch stops, second etching is performed on the thin dielectric. A metal layer is deposited on the substrate, then planarized. Thus, an analog capacitor is configured.;COPYRIGHT: (C)2004,JPO
机译:解决的问题:提供一种在半导体衬底上形成模拟电容器的方法和设备。解决方案:该方法包括在一部分衬底上形成场氧化层,并在衬底上形成多晶硅层的工艺。场氧化物,然后在该层上形成硅化物层。在基板上形成第一层间电介质层,并形成电容器掩模图案。使用电容器掩模图案作为掩模并且使用硅化物层作为蚀刻停止层,蚀刻第一层间电介质层以在基板上形成薄电介质。接触掩模图案形成在基板上。使用硅化物层和衬底作为蚀刻停止,对薄电介质执行第二蚀刻。金属层沉积在基板上,然后被平坦化。因此,将配置一个模拟电容器。;版权所有:(C)2004,JPO

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