RELAY BOARD, RELAY BOARD WITH SEMICONDUCTOR DEVICE, BOARD WITH THE RELAY BOARD, AND STRUCTURE COMPOSED OF THEM

摘要

PROBLEM TO BE SOLVED: To provide a structure where reliability can be imparted to a junction portion of a semiconductor device and which is composed of a comparatively low-cost semiconductor element, a relay board, and the main board.;SOLUTION: The structure 11 is composed of the semiconductor device 21, the relay board 31, and the board 41. The semiconductor device has a thermal expansion coefficient of 2.0 ppm/°C or larger and smaller than 5.0 ppm/°C and has a surface connection terminal 22. The substrate 41 has a thermal expansion coefficient of 5.0 ppm/°C or larger and has a surface connection pad 46. The relay substrate 31 includes a main relay board body 38 and a plurality of conductive posts 35. The relay board body 38 is a substantially sheet-shaped member of an organic insulating material having the through-holes 34. The conductive posts 35 are arranged inside the through-holes 34. The plural conductive posts 35 are electrically connected to the surface connection terminals 22 and to the surface connection pads 46.;COPYRIGHT: (C)2005,JPO&NCIPI