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METALLIC STRIP FOR STRIPE PLATING AND MANUFACTURING METHOD OF STRIPE PLATING STRIP

机译:条纹镀覆用金属带及条纹镀覆带的制造方法

摘要

PROBLEM TO BE SOLVED: To provide a metallic strip for stripe plating, with which a partial gold plating can be conducted to a metallic strip with high quality and high accuracy and a nickel barrier region can be formed surely and which can deal with the miniaturization of an electronic part, and a manufacturing method, by which the stripe plating strip, to which the stripe plating is carried out, can be manufactured with excellent workability by using the metallic strip for such a stripe plating.;SOLUTION: A tie bar 10 is installed while being positioned between adjacent terminals 3 and 3. A minimum space E formed between the end face 12a of a plating-solution preventive section 12 for the tie bar 10 and the end face 5a of a terminal contact section 5 is formed in a size, such that the penetration of a gold plating solution and a current to the direction of a soldering section 6 through an opening (g) between the end face 5a of the contact section and the end face 12a of the section 12 is inhibited, in the case of a partial plating to the contact section 5.;COPYRIGHT: (C)2004,JPO&NCIPI
机译:解决的问题:提供一种用于带状电镀的金属带,利用该金属带可以对金属带进行高质量和高精度的部分镀金,并且可以确定地形成镍阻挡区,并且可以应对镍的小型化。电子部件及其制造方法,通过使用金属条进行电镀,可以以极好的可加工性制造进行了电镀的条纹电镀条。安装在相邻端子3和3之间的同时,在连接杆10的镀液防止部12的端面12a与端子接触部5的端面5a之间形成有最小间隔E。 ,使得镀金溶液和电流通过接触部分的端面5a与部分12的端面12a之间的开口(g)朝焊接部分6的方向渗透。在接触部分5的部分镀层的情况下被抑制;;版权:(C)2004,JPO&NCIPI

著录项

  • 公开/公告号JP2004241728A

    专利类型

  • 公开/公告日2004-08-26

    原文格式PDF

  • 申请/专利权人 FUJI DENSHI KOGYO KK;

    申请/专利号JP20030031655

  • 发明设计人 NOBEYOSHI RYOICHI;

    申请日2003-02-07

  • 分类号H01L23/50;C25D5/02;C25D7/06;C25D7/12;H01L23/48;

  • 国家 JP

  • 入库时间 2022-08-21 23:32:58

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