PLATING BATH FOR FORMING THIN RESISTANCE LAYER, METHOD OF FORMATION OF RESISTANCE LAYER, CONDUCTIVE BASE WITH RESISTANCE LAYER AND CIRCUIT BOARD MATERIAL WITH RESISTANCE LAYER

摘要

PROBLEM TO BE SOLVED: To provide a plating bath capable of forming a thin resistance layer with a uniform thickness distribution on the roughened surface of a conductive base, to provide a conductive base having a thin resistance layer with a stable resistance, and a resistance circuit board material obtained by using the same.;SOLUTION: The plating bath forms a thin film resistance layer on the surface of a conductive base. The plating bath includes nickel ions and sulfamic acid or its salt as essential components and at least one of phosphoric acid, phosphorous acid, hypophosphorous acid, and salts of the same. The conductive base has the thin resistance layer formed by the plating bath, and the resistance circuit board material is obtained by using the same.;COPYRIGHT: (C)2004,JPO