首页> 外国专利> LOW AGGREGATIVE SILVER POWDER AND ITS MANUFACTURING METHOD, AND CONDUCTIVE PASTE USING LOW AGGREGATIVE SILVER POWDER

LOW AGGREGATIVE SILVER POWDER AND ITS MANUFACTURING METHOD, AND CONDUCTIVE PASTE USING LOW AGGREGATIVE SILVER POWDER

机译:低凝银粉及其制造方法,以及使用低凝银粉的导电浆料

摘要

PROBLEM TO BE SOLVED: To provide a silver powder which is a fine particle and possesses excellent dispersibility (low aggregativity) which a conventional silver powder does not possess, and at the same time possesses a large crystallite diameter.;SOLUTION: The silver powder is produced by a wet reduction process, and an average particle diameter D50 by a laser diffraction scattering type particle size distribution measuring method is 0.1-3 μm, and a low aggregative silver powder characterized by a value of the degree of aggregation expressed with D50/DIA using the average particle diameter D50 and the average particle diameter DIA obtained by image analysis being 5.0 or less is used. Moreover, in order to acquire the low aggregative silver powder, slurry of silver chelate complex which used ethylenediamine tetraacetic acid salt as complexing agent is used as materials, and a manufacturing method using wet reduction process is adopted.;COPYRIGHT: (C)2004,JPO
机译:解决的问题:提供一种银粉,该银粉是细粉并且具有常规银粉不具有的优异的分散性(低聚集性),同时具有大的微晶直径。通过湿法还原法制备的,通过激光衍射散射式粒度分布测量方法测得的平均粒径D 50 为0.1-3μm,特征在于其值为平均粒径D 50 和平均粒径D IA,用D 50 / D IA 表示的聚集度使用通过图像分析获得的5.0以下的。此外,为了获得低聚集银粉,使用以乙二胺四乙酸盐为络合剂的螯合银络合物的浆料为原料,并采用采用湿还原法的制造方法。版权所有:(C)2004,日本特许厅

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