首页> 外国专利> Thin film production manner and its application in the special substrate

Thin film production manner and its application in the special substrate

机译:薄膜的生产方式及其在特殊基材上的应用

摘要

Portion and the component of process step and the addition formation where this invention, in order at least to embrittle part 2 locally at least one component 6, in regard to the production manner of the thin film 8 which installs 6A and 6B, the addition formation forms 2 which is formed, 3 and 4 in substrate, 1 consists of the material where differ from the substrate and the embrittlement possible part, and/or at least in embrittlement step and the addition formation which generate the preparation step and brittle sublayer 5 which possesses the micro structure which differs in this embrittlement possible part one component 6, forms 6A and 6BIn order to obtain the thin film 8 which is installed, the embrittlement possible part, includes with the separable step which is detached according to brittle sublayer.
机译:关于本发明,为了至少局部地使部分2脆化至少一个成分6,本发明的工序的部位和成分以及添加形成,关于设置有6A和6B的薄膜8的制造方式而言,添加形成在基材中形成的形式2、3和4,形式1由与基材和脆化可能部分不同的材料组成,和/或至少在脆化步骤和生成制备步骤的加成形成中以及脆性子层5,在该脆性可能部分中具有不同的微观结构的一个成分6,形式6A和6B为了获得所安装的薄膜8,脆性可能部分包括根据脆性子层而分离的可分离步骤。

著录项

相似文献

  • 专利
  • 外文文献
  • 中文文献
获取专利

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号