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CHIP TRANSFER APPARATUS AND SEMICONDUCTOR MANUFACTURING METHOD USING THE CHIP TRANSFER APPARATUS
CHIP TRANSFER APPARATUS AND SEMICONDUCTOR MANUFACTURING METHOD USING THE CHIP TRANSFER APPARATUS
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机译:芯片转移装置及使用该芯片转移装置的半导体制造方法
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摘要
PROBLEM TO BE SOLVED: To provide a chip transfer apparatus capable of eliminating an additional labor and work upon transferring a chip with suppressed equipment investment.;SOLUTION: There is provided a controller 19 for controlling the operation of a chip transfer mechanism section 15. The controller 19 executes a reversible control sequence such that in a chip storing mode the chip transfer mechanism section 15 transfers a chip from a line input wafer ring 6 set to an inloader section 2 to a chip storing tray 11 set to an outloader section 3, and in a line input mode the chip transfer mechanism section 15 transfers a chip 7 from the tray 11 set to the outloader section 3 to the wafer ring 6 set to the inloader section 2.;COPYRIGHT: (C)2004,JPO
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