首页> 外国专利> ELECTROLYTIC COPPER FOIL WITH CARRIER FOIL AND ITS PRODUCING METHOD, AND COPPER CLAD LAMINATED BOARD USING THE ELECTROLYTIC COPPER FOIL WITH CARRIER FOIL

ELECTROLYTIC COPPER FOIL WITH CARRIER FOIL AND ITS PRODUCING METHOD, AND COPPER CLAD LAMINATED BOARD USING THE ELECTROLYTIC COPPER FOIL WITH CARRIER FOIL

机译:带有载体箔的电解铜箔及其生产方法,以及带有带有载体箔的电解铜箔的覆铜板层压板

摘要

PROBLEM TO BE SOLVED: To provide an electrolytic copper foil with carrier foil for producing a printed board with which peeling strength between the carrier foil and the electrolytic copper foil layer can properly be secured, even after press-working at high temperature, such as 250C.;SOLUTION: In the electrolytic copper foil with the carrier foil provided with a joining boundary layer on one side of the carrier foil C and the electrolytic copper foil layer CF on this joining boundary layer, this joining boundary layer is made of chromium compound-base joining boundary layer 2 composed of chromium oxide, chromium hydroxide, and a chromate. This electrolytic copper foil 1a is provided with the joining boundary layer 2 on its one side.;COPYRIGHT: (C)2004,JPO
机译:解决的问题:提供一种带有载体箔的电解铜箔,该电解铜箔用于生产印刷电路板,即使在高温例如250℃下进行冲压加工后,也可以适当确保载体箔和电解铜箔层之间的剥离强度。解决方案:在电解铜箔中,在载体箔C的一侧上设有接合边界层且在该接合边界层上具有电解铜箔层CF的载体箔中,该接合边界层由铬化合物制成-基底接合边界层2由氧化铬,氢氧化铬和铬酸盐组成。该电解铜箔1a的一侧具有接合边界层2。版权所有:(C)2004,日本特许厅

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