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ELEMENT TRANSFER METHOD, SUBSTRATE FOR ELEMENT TRANSFER, AND DISPLAY DEVICE

机译:要素转移方法,要素转移基质和显示装置

摘要

PROBLEM TO BE SOLVED: To provide an element transfer method which can exfoliate a substrate easily after the element is transferred from a substrate where elements are arranged to another substrate, is capable of reducing the substrate damages, and imprinting to add an element on the same substrate again after printing the element, and to provide a substrate for element transfer and a display device.;SOLUTION: A plurality of elements arranged on a temporary holding substrate are buried in an adhesive layer formed on a transfer substrate and held. The elements are exfoliated from the substrate. The adhesive layer is selectively hardened, a cured wall is formed and the adhesive layer is divided into micro cells, thereby preventing the adhesive layer from moving by pressure. A transfer substrate side of the adhesive layer is hardened and a cured layer is formed, and the elements are fixed by the cured layer, thereby preventing the displacement of the elements in the adhesive layer. The adhesive layer is softened after the elements are buried in the adhesive layer, thereby reducing the step-difference in a boundary of the elements and the adhesive layer.;COPYRIGHT: (C)2005,JPO&NCIPI
机译:解决的问题:提供一种元件转移方法,该方法可以在将元件从布置有元件的基板转移到另一基板后容易地剥离基板,并能够减少基板的损坏,并在其上压印以添加元件。在印刷元件之后,再次将基底层压,并提供用于元件转移的基底和显示​​装置。解决方案:将布置在临时保持基底上的多个元件掩埋在形成于转移基底上的粘合剂层中并保持。元素从基材上脱落。粘合剂层被选择性地硬化,形成固化的壁并且粘合剂层被分成微单元,从而防止粘合剂层由于压力而移动。粘合层的转印基板侧被硬化并形成固化层,并且通过固化层将元件固定,从而防止了元件在粘合层中的移位。在将元件掩埋在粘合剂层中之后,使粘合剂层变软,从而减小了元件和粘合剂层之间的边界处的阶梯差。;版权所有:(C)2005,JPO&NCIPI

著录项

  • 公开/公告号JP2004281630A

    专利类型

  • 公开/公告日2004-10-07

    原文格式PDF

  • 申请/专利权人 SONY CORP;

    申请/专利号JP20030069635

  • 申请日2003-03-14

  • 分类号H01L21/52;G03F7/20;G09F9/00;H01L21/50;H01L33/00;

  • 国家 JP

  • 入库时间 2022-08-21 23:29:54

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