ELECTROLESS PLATING BATH, AND METHOD OF FORMING METAL PROTECTIVE FILM USING THE ELECTROLESS PLATING BATH

摘要

PROBLEM TO BE SOLVED: To provide an electroless plating bath with which plating can selectively be applied to the surface of metal wiring of copper or the like formed on a substrate for an electronic circuit, and also, contamination caused by alkali metals in the wiring and substrate can be prevented.;SOLUTION: The electroless plating bath comprises cobalt ions, phosphinate ions and a complexing agent. As the main feed source of the cobalt ions and phosphinate ions, cobalt phosphinate is used, and alkali metal ions are substantially contained in the plating bath.;COPYRIGHT: (C)2004,JPO&NCIPI