首页> 外国专利> METHOD FOR MANUFACTURING HIGH FREQUENCY MODULE PROVIDED WITH HIGH FREQUENCY CIRCUIT DEVICE, AND MEASURING INSTRUMENT FOR HIGH FREQUENCY CIRCUIT DEVICE

METHOD FOR MANUFACTURING HIGH FREQUENCY MODULE PROVIDED WITH HIGH FREQUENCY CIRCUIT DEVICE, AND MEASURING INSTRUMENT FOR HIGH FREQUENCY CIRCUIT DEVICE

机译:制造具有高频电路装置的高频模块以及测量高频电路装置的仪器的方法

摘要

PPROBLEM TO BE SOLVED: To measure a characteristic of a first high frequency circuit device before assembling the first high frequency circuit device and a second high frequency circuit device in a high frequency module formed by assembling the first high frequency circuit device having one nonradioactive dielectric line of two nonradioactive dielectric lines constituting a directional coupler and the second high frequency circuit device having the other nonradiactive dielectric line. PSOLUTION: The characteristic of the first high frequency circuit device is measured by configuring the directional coupler by making a measuring instrument having the same structure as that of the nonradioactive dielectric line formed in the second high frequency circuit close to the other nonradioactive dielectric line of the directional coupler formed in the first high frequency circuit device. PCOPYRIGHT: (C)2004,JPO
机译:

要解决的问题:在将第一高频电路装置和第二高频电路装置组装到通过组装具有第一高频电路装置的第一高频电路装置而形成的高频模块中之前,要测量第一高频电路装置的特性。构成定向耦合器的两条非放射性电介质线中的两个非放射性电介质线和具有另一条非放射性电介质线的第二高频电路装置。

解决方案:通过使定向测量仪的结构与第二高频电路中形成的非放射性电介质线的结构接近另一个非放射性电介质,通过配置定向耦合器来测量第一高频电路装置的特性在第一高频电路装置中形成的定向耦合器的线。

版权:(C)2004,日本特许厅

著录项

  • 公开/公告号JP2004128918A

    专利类型

  • 公开/公告日2004-04-22

    原文格式PDF

  • 申请/专利权人 MURATA MFG CO LTD;

    申请/专利号JP20020290715

  • 申请日2002-10-03

  • 分类号H01P11/00;G01S7/03;G01S7/40;H01P3/16;H01P5/18;

  • 国家 JP

  • 入库时间 2022-08-21 23:28:47

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