POLISHING DEVICE FOR HARD, BRITTLE SHEET

摘要

PROBLEM TO BE SOLVED: To improve wear distance property of a polishing device used for lapping or polishing hard, brittle sheets, such as semiconductor wafers, which is worsened by down-sizing the device that is designed to polish each sheet, by reducing the ratio of the polishing target object to the diameter of the base board and thereby making the device smaller.;SOLUTION: In order to improve wear distance property of the device worsened by making the diameter of the base board smaller, the rotary base board for polishing the hard, brittle sheet through sliding movement is divided into an internal base board 4 and an external base board 5, with a round dividing line 3 as the demarcation border, and they are revolved at different angular velocity. In the case of a polishing device structured to sandwich a hard, brittle sheet between an upper lap and a lower lap, each of both upper and lower laps is divided into the internal and external laps 4, 5, with both driven to revolve at different angular velocity. By cutting suitable shapes of grooves into laps, the wear distance property is improved.;COPYRIGHT: (C)2004,JPO