As the super-conductivity magnetic shielded board for the super-conductivity magnetic shielded body production mannered null

摘要

PURPOSE: To improve an accuracy of a maximum standard current by bonding plural QMG bulk materials with each other by a specific solder. ;CONSTITUTION: QMG bulks of REBa₂Cu₃O₇ (RE is one of more elements selected from Nd, Sm, Eu, Gd, Dy, Y, Ho, Er, Tm, Yb and Lu) are placed in such a manner as to mutually coincide the crystal orientations of the QMG bulks to be bonded with each other at a bonding plane and a powdery solder material of RE'Ba₂Cu₃O₇ (RE' is RE) having a lower peritectic temperature than that of the QMG bulk materials is inserted into the bonding plane. The articles are heated at a temperature higher than the peritectic temperature of RE'Ba₂Cu₃ O₇ and lower than that of REBa₂Cu₃O₇ to keep the solder in a semimelted state and form a liquid phase. Subsequently, they are annealed with a cooling speed of 1-5°C/hr in a temperature range of ±10°C of the peritectic temperature of the solder. In this process, RE'Ba₂Cu₃O₇ crystallizes into the same direction of the crystal orientation of REBa₂Cu₃O₇ to bond the QMG bulks.;COPYRIGHT: (C)1995,JPO