THERMALLY CONDUCTIVE MULTILAYER SUBSTRATE AND SUBSTRATE FOR POWER MODULES

摘要

PROBLEM TO BE SOLVED: To provide a substrate for a power module, which meets both a long life and good thermal conductivity to temperature cycles.;SOLUTION: The substrate is provided with an insulating substrate 2, a circuit layer 3 laminated on a side of the insulating substrate 2, a metal layer 4 laminated on the other side of the insulating substrate 2, a semiconductor chip 5 mounted on the circuit layer 3 via solder 7, and a radiator 6 connected to the metal layer 4. The circuit layer 3 and the metal layer 4 are made of copper with purity of 99.999% or more. The internal stress is not accumulated even by repeating application of the temperature cycles, and the life to the temperature cycles is extended. As the circuit layer 3 and the metal layer 4 are made of copper with good thermal conductivity, heat from the semiconductor chip 5 is released by effectively transferring it to the radiator 6.;COPYRIGHT: (C)2004,JPO&NCIPI