The non electrolysis nickeling bath for acicular coat formation which non electrolysis nickeling bath and the formation mannered

摘要

PROBLEM TO BE SOLVED: To improve the adhesion of the film with a resin or the like by incorporating it with Ni ions, hydrazine and glycine or the derivative thereof. ;SOLUTION: Preferably, the concn. of Ni ions in a plating bath is controlled to about 0.05 to 0.2 mol/l, the concn. of hydrazine as a reducing agent to about 0.1 to 0.2 mol/l, and the concn. of glycine or the derivative thereof as a complexing agent to about 0.1 to 0.5 mol/l. In the plating bath, Ni is reduced by the oxidation reaction of hydrazine, and, at this time, hydroxyl ions are consumed, and its pH rapidly drops. As a result, the deposition rate of Ni is made slow, therefore, the addition of boric acid as a buffer is preferable, and its concn. is controlled to about 0.1 to 0.7 mol/l. In this way, the plating bath is made stable, and the deposition rate is made high. Then, the surface form of the deposited Ni is acicular one, so that the application to an adhesion layer of an insulating layer and a conductor layer in a printed circuit board or the like is made possible.;COPYRIGHT: (C)2000,JPO