Thin film thermocouple integration die thermoelectric conversion device

摘要

PROBLEM TO BE SOLVED: To obtain high-thermoelectric conversion efficiency and provide a low-cost integrated thin film thermocouple thermoelectric conversion device in a form that whatever the kinds of a thin film material are, films can be formed, heat is absorbed in both surfaces of a flat plate structure and heat is dissipated from both surfaces of the flat plate structure.;SOLUTION: An integrated thin film thermocouple thermoelectric conversion device is constituted on a structure that thin film thermocouples 22 formed by stacking P-type and N-type thermoelectric semiconductor thin films 27 and 28 via each electrical bonding layer 29 between the films 27 and 28 on one end part of a substrate 23 and via each insulating layer 31 between the films 27 and 28 on the rest of the substrate 23 are arranged and formed on the substrate 23. Each thin film thermocouple 22 are electrically series-connected with each other through conductors 32. Projected parts 35 and 36 provided on a top plate 24 and a base plate 25, both consisting of a heat conductor, are brought into contact with the parts, on which the layers 29 are located, in the thermocouples 22 and the conductors 32 on the opposite side to the parts respectively.;COPYRIGHT: (C)2003,JPO