In the implemental manner of the semiconductor chip, the production manner of the Liquid Crystal Display and the implemental manner

摘要

PROBLEM TO BE SOLVED: To provide a method for mounting an IC and a method for manufacturing a liquid crystal display device which can prevent the IC from malfunctioning due to the light entering from the top surface part of the chip without adding any new process. ;SOLUTION: In the COG mounting method which heats and bonds the liquid crystal driving IC 13 mounted on a substrate 2 by a thermocompression head T2 from a chip top surface part 131 and electrically connects it by an anisotropic conductive film ACF, a light shield material supply sheet SD is sandwiched between the chip top surface part 131 and thermocompression head T2 at the time of compression by the head T2 and then a light shield material D is transferred from the light shield material supply sheet SD to form a light shield film DD on the chip top surface part 131. Therefore, the liquid crystal driving IC 13 can be prevented from malfunctioning due to the light entering from the chip top surface part 131.;COPYRIGHT: (C)1999,JPO