首页> 外国专利> DIAMOND GRANULAR BODY CONTAINING NITROGEN AND BORON HAVING CONDUCTIVITY AND FLUIDIZED-BED ELECTRODE USING THE DIAMOND GRANULAR BODY

DIAMOND GRANULAR BODY CONTAINING NITROGEN AND BORON HAVING CONDUCTIVITY AND FLUIDIZED-BED ELECTRODE USING THE DIAMOND GRANULAR BODY

机译:含氮和硼的金刚石粒状体的导电性及使用金刚石粒状体的流化床电极

摘要

PPROBLEM TO BE SOLVED: To provide a diamond granular body that has conductivity by containing nitrogen and boron and a fluidized bed electrode using the same. PSOLUTION: Each powder is mixed with a mixing ratio of 0.5-15 wt%, preferably 0.5-10 wt% of boron compound powder, 76-98.9 wt%, preferably 81-98.8 wt% of easily-graphitizable carbon powder, and 1-9 wt% of artificial graphite powder. This mixture is mixed for one minute to two hours by a mixer such as a V-shaped mixer and a ball mill. The mixture is molded by a means such as an extrusion molding, a cold isotropic pressure molding method, and a hot molding so as to become any shape and size, and calcined (first calcining) in the non-oxidizing atmosphere at temperatures of 600C-1,300C. After the first calcining, the mixture is calcined (second calcining) in the inert gas atmosphere at a temperature of 1,800C-2,200C, preferably 1,900C-2,100C. Then, it is heat treated in the non-oxidizing atmosphere at a temperature of 2,400C-2,600C and graphitization is further increased and the impurities are sublimated, and a graphite of high impurity is obtained. PCOPYRIGHT: (C)2004,JPO
机译:

要解决的问题:提供一种通过包含氮和硼而具有导电性的金刚石粒状体以及使用其的流化床电极。

解决方案:将每种粉末以0.5-15 wt%,优选0.5-10 wt%的硼化合物粉末,76-98.9 wt%,优选81-98.8 wt%的易石墨化碳粉的混合比例进行混合, 1-9wt%的人造石墨粉。通过诸如V形混合器和球磨机的混合器将该混合物混合1分钟至2小时。通过诸如挤出成型,冷各向同性压力成型方法和热成型的方法将混合物成型为任何形状和尺寸,然后在非氧化性气氛中于600℃进行煅烧(第一次煅烧)。 1300℃。第一次煅烧后,将混合物在惰性气体气氛中于1800℃至2,200℃,优选为1,900℃至2,100℃的温度下煅烧(第二次煅烧)。然后,在2,400℃至2,600℃的温度下在非氧化性气氛中进行热处理,并进一步增加石墨化作用,并使杂质升华,从而获得高杂质的石墨。

版权:(C)2004,日本特许厅

著录项

  • 公开/公告号JP2004039372A

    专利类型

  • 公开/公告日2004-02-05

    原文格式PDF

  • 申请/专利权人 TOYO TANSO KK;

    申请/专利号JP20020193180

  • 申请日2002-07-02

  • 分类号H01B1/04;C01B31/06;C02F1/461;C25C1/00;H01B1/00;

  • 国家 JP

  • 入库时间 2022-08-21 23:26:30

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