CURABLE COMPOSITION FOR OPTICAL MATERIAL, OPTICAL MATERIAL, METHOD FOR PREPARING OPTICAL MATERIAL AND LIGHT EMITTING DIODE USING THE OPTICAL MATERIAL

摘要

PROBLEM TO BE SOLVED: To provide a composition for an optical material in which soft solder cracking resistance is increased by suppressing an internal stress and there causes no degradation such as coloring of a resin upon surface mounting, an optical material using the composition, and a light emitting diode using the optical material.;SOLUTION: The curable composition for the optical material comprises (A) an organic compound containing a C-C double bond reactive with an SiH group, (B) a silicon compound containing at least two SiH groups in a molecule, and (C) a hyroxylating catalyst as the essential ingredients, in which an internal stress upon curing the composition in a package shown by the following equation (internal stress (MPa)) is 15 MPa or lower. [Internal stress (Mpa)]=[( the final curing temperature (C))-(Tg (C) of the cured substance)] x [(coefficient of linear at higher than Tg of the cured material)-(coefficient of linear at higher than Tg of the package)] x [tensional storage modulus (MPa) at Tg of the cured material].;COPYRIGHT: (C)2004,JPO